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Principal Product Validation Engineer (Greater Boston area)
View: 173
Update day: 12-06-2024
Location: Burlington Ontario
Category: Quality Assurance / Quality Control
Industry: Information Technology Services Computer Software Semiconductors
Position: Entry level
Job type: Full-time
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Job content
At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology.We are seeking a passionate and motivated engineer to join our Development team in support of the Allegro PCB and IC packaging product lines. This position is part of a multi-faceted team comprised of design disciplines including: MCAD, Signal Integrity, Thermal, Logical Capture, PCB Design and IC packaging.
This position is responsible for the verification of the end users experience, to ensure our products exceed the user’s expectations. There is tremendous opportunity for growth in this position working directly with experts in each of these fields.
Title: Principal Product Validation Engineer
Location: Burlington, Massachusetts (Greater Boston area)
Must Haves
- 5 years’ experience in IC packaging design domain
- Understanding of wirebonding, flipchip and stacked die packaging technologies
- Strong understanding of various packaging construction methods
- Experience with electronic component packaging tools
- Basic programing understanding. Able to write simple Unix shell scripts
- Must have strong communication skills oral and written
- Ability to lead and work well in a team environment
- Validation of physical and spacing constraint feature implementations
- Validation of wirebonding, flipchip and stacked die packaging feature implementations
- Participate in team environments
- Evaluate product/feature requirement specifications
- Validate new feature development
- Author test plans and bug reports
- Provide Test automation support
- Tool experience: Allegro APD/SIP, Laker, Allegro PCB Designer, Xpedition, Altium, AutoCAD, Any logical capture tool
- Design Experience: Production validation sign-off, various physical package types, RF, analog, high power, low power, PCB layout
- Working knowledge of: Cadence SKILL, Web design, SQL, Python, HTML, CSS, Javascript, Bootstrap, AJAX, Object Oriented Programming Principles, web frameworks like Flask , Django. Perforce, REST API, Redis, Nginx, Web Application Deployment
- Platform experience: Windows 10; Window server 2016, SLES:12, Centos 6, RH 6.x, RH7.x
- Willing to participate in programming and creating custom scripts within our environment
- Understanding of manufacturing output data required for fabrication, assembly and test of component packaging processes
- Engineering bachelor’s degree or equivalent experience
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Deadline: 27-07-2024
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